SIPLACE SX

Our placement solution for high-mix 

electronics production

With the SIPLACE SX, your factory is ready for anything that comes along.

The SIPLACE SX was designed to be flexible. It is the world’s only platform that lets you scale up or down or transfer capacity by adding or removing the unique SX gantries.

With the SIPLACE SX we have made our most successful placement solution even better:

• Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily
• The SIPLACE SpeedStar for high-speed and placement of components as small as 0201 (metric) with maximum precision
• SIPLACE TwinStar: The head for special tasks
• SIPLACE MultiStar: Switches between placement modes on demand
• ASM Smart Transport Module: Process PCBs with lengths of up to 1.525 meters
• LED centering: Align components based on top-side features
• Place critical components reliable with the SIPLACE OSC Package
• Touchless placement: Maximum placement quality for highly sensitive components
• SIPLACE SpeedStar and SIPLACE MultiStar heads can operate jointly in the same placement area for more flexibility and performance.
• Minimum placement force: 0.5 N
• SIPLACE Smart Pin Support: Automated pin support for printed circuit boards
• NEW: Up to 17% higher performance